Laser Wire Stripping System

Description:

Developed by NASA in the 1970s – 1980s as part of the space shuttle program, as the risk of damaging the delicate electrical conductor was apparent with traditional stripping methods/systems.

 

The NoNic™ Benchtop provides the most accurate tools to strip and slit wire insulation successfully.

 

No other product on the market can compare to our system’s ability to strip and slit most varieties of wire cleaner, faster, and easier than ever before. The NoNic™ Benchtop laser series is the premier solution for removing troublesome wire insulation effectively without harming the wires underneath. The NoNic™ Benchtop comes in a newly redesigned compact Benchtop configuration for easy access and quick operation. This system can safely strip wires as small as 0.030″ and handle tolerances as tight as .001″ as well. We can safely remove 99% of all insulation with 10 second changeover or less. No more need for exactor knives and tweezers – Our NoNic™ Benchtop products take all the tedium and frustration out of the equation.

 

  • Strip difficult wire insulation safely with No Damage to the wires underneath – including Teflon® material.
  • Easily Strip a wide range of wire types, sizes, and gauges. Sizes as small as 0.030″ with tolerances as tight as .001″
  • Quick Changeover from one wire size to another with our included tooling.
  • Built-in User friendly laser software for processing wires with ease and accuracy.

 

Each NoNic™ desktop system comes with 5-sets of wire guides. The wire guides are the tooling that determine the gauge of wire that the system can process. A total of 10-sets are available for wire diameters from 0.030″ (20AWG, 0.51760mm²) to 0.75″ (8/0AWG, 293.8908mm²). Custom wire sizes are available upon request.

Laser Wire Stripping System

More Laser Application:

The FA Cube™ was specifically designed with the semiconductor failure analysis and forensics Labs in mind. Our compact laser semiconductor laser decapsulation system provides clean and accurate laser IC Laser Decapsulation with reliable results. The FA Cube™ incorporates the same patented process as our FALIT™ series. This patented laser process uses multiple laser configurations to provide clear and precise test samples for nearly every type of semiconductor failure analysis and forensic application.

  • Ideal Solution for IC Laser Decapsulation and removing large filler mold compounds for copper.
  • Cleanly remove mold compound using laser technology rather than the traditional unsafe acid process.
  • Expose Wire Bonds without damage to other components.
  • Fixed Co-Axial Optical Camera Lens (options available).
  • Optional X-Y stage table and Self-Centering Fixture.
  • Easy sliding door with large viewing window and internal workspace.
  • Compact Motorized Z-Axis for accuracy (optional).
  • FALIT™ Light Laser Software interface included. Basic GUI for Failure Analysis.

 

Software

Our essential FA Cube intuitive software allows the laser decapsulation of IC components for bond and die inspection. Aside from the standard software features, we offer a variety of modules and tools to extend the abilities of the machine per request.

 

Optional Software Tools:

  • Gasket Module
  • Polygon tools/Ortho Mode
  • Surround Mode
  • Text Mode
  • Image Import
  • Template Creation
  • Recipe Manager

IC Silicone Gel Compound Removal

A growing number of IC design are utilizing a gel type encapsulation  compounds.

Whether it is for diaphragm on the die of a pressure detection device. Less stress on the newer thinner dies, or extreme temperature variation and vibrations faced by automotive industry control semiconductor devices, this silicone gels seems impervious to chemical, plasma or even standard laser decapsulation..

Most power and MEM devices are silicone encapsulated.

 

A Case Note.

The SIFEL® gel from SHIN-ETSU is a remarkable material used in many semiconductors. Common devices using SIFEL® gel are MEMS devices and pressure sensors where low-stress encapsulation of sensitive electronic devices, but maximum protection against heat and chemicals, is important. SIFEL®’s advantages present unique challenges to failure analysis labs that need to remove the gel in order to determine why a device failed. With it’s near-impervious chemical resistance, acids and many other chemicals have no effect on the gel.

 

CLC has developed a laser application that uses SIFEL® gel properties to the advantage removing it

 

Using our proprietary ICO laser, and a carefully engineered removal recipe, the majority of the gel can be removed without too much problem.

 

CLC FALiT Gel Decapsulation Safely Removes Gel Compound “ALL THE WAT TO THE DIE” in second’s.

UNIQUES SILICONE GEL COMPOUND REMOVAL LASER TECHNIQUE
FALIT Gel

INSTAMARK® laser marking and engraving system is capable of marking and engraving the widest range of materials such as steel/stainless, aluminum, titanium, ceramics and some plastics. With your choice of laser type [Q-Switched Fiber, or MOPA Fiber], power level, the capability to transform from a class I/II laser system, to a class IV laser system, there is not much that this laser system cannot mark on. Alpha-numerics, graphics, and barcodes can be marked up to 1,250 characters per second using our state-of-the-art high-speed, high-accuracy, galvo head. The affordable price and compact desktop size makes the Instamark® perfect for small shops with limited space.

Standard Specification

  • Alpha-numeric, graphics, and barcodes can be marked up to 1,250 characters per second
  • Transformable Class I/II or Class IV Laser System
  • Laser power, 20 Watts, 30 Watts or 50 Watts
  • 7” lasing area with standard lens
  • 9″ x 11.75″ x 2″ lasing area with optional 11.75″ lens
  • 12″ x 17″ x 7″ working area in Class I/II mode
  • Accommodates Q-Switched or MOPA Fiber Laser markers and engravers
  • Can be easily integrated into any production or assembly line for on-the-fly marking
  • Integrated Windows Computer, with External Monitor/Keyboard/Mouse, Included
  • Enclosure Illumination
  • Exhaust Port and Plumbing
  • Compact and Rugged Desktop System, L28.3″ x W22.5″ x H31″
  • Optional Rotary Available
  • Building Block Design
  • 115 VAC/230VAC Operation
  • Laser Marking Studio™ (LMS) Software – User friendly laser marking GUI included

Control Laser is a pioneer being the first laser marking company to fully implement FDAGS1 and HIBCC® UDI medical marking standards into laser marking systems. CLC Medical UDI-Mark™ systems mark a variety of components and materials with FDA UDI compliant AIDC , GTINGLN and HIBC marks. The materials used in the medical industry include: metals, plastics, composites, ceramics, and more. Medical device manufacturers have relied on our compliant systems to provide the traceability requirements of medical marking because we understand these complex rules.

 

GS1 and HIBCC UDI Medical Laser Applications

Control Laser’s GS1 and HIBCC UDI medical laser marking systems come in a wide variety of wavelengths, power levels and beam profiles which give us the ability to mark any type of material or part.

Traceability is the core purpose for implementing the UDI marking rules since every piece that goes into a human needs to be accounted for. Being able to trace the part back to the source is imperative if there is some complication, but providing a mark that does not create an issue is also very important. With CLC’s experience in medical marking allows us to understand this application and assist our customers in providing proven UDI laser marking systems

 

The Medical UDI-Mark™ laser marking systems provide both GS1 and HIBCC UDI laser markings on a variety of components used in the medical industry. With over 50-years of experience in the medical laser marking industry, Control Laser can provide you with the complete turn-key solutions you need for your FDA compliant marks.

  • FDA Compliant Laser Marker
  • Sub-millimeter and above marking sizes
  • Windows Computer included
  • Enclosure Illumination
  • Inspection and mark verification solution (optional)
  • Exhaust Port and Plumbing
  • Rugged Enclosure
  • Optional Rotary Available
  • 115 VAC Operation (220 VAC Optional)
  • Laser Marking Studio™ (LMS) Software – User friendly GUI included.

Some advantages of working with Control Laser for your UDI medical marking needs:

  • Mark permanent GS1 and HIBCC traceability barcodes onto medical appliances and implants
  • Meet the FDA regulations regarding the biocompatible marking of GS1 and HIBCC UDI codes onto medical devices
  • Verify the parts and marks using our optional part and mark verification devices
  • Mark flat, 3D, and cylindrical parts with ease in nearly any font and all of the FDA compliant GS1 and HIBCC codes

 

Dental Clamps , Cardiac pacemakers, defibrillators, guidewires, catheters, hearing aids, brachyseeds, orthodontic components, prosthetics, cannulae, Hypodermic Needles, Hemostats, Surgical Screws, Stints  and surgical tools are just a few of our proven applications!

 

We also have Medical UDI-Mark™ systems for micro-welding and micro-cutting intricate and sensitive parts used in the medical industry.

Medical UDI-Mark™ FDA, GS1 and HIBCC UDI Laser Marking System
Medical UDI-Mark™ FDA, GS1 and HIBCC UDI Laser Marking System

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