Bond / Peel Tester

Title:
Bond / Peel Tester
Category: 
Failure Analysis

Applications:

  • Wire Pull
  • Ball Shear
  • Die Shear

VPM Technology (Vertical Point Movement and Positioning)

  • FAST & SOFT TARGET CONTACT (5≈15 gram contact force).
  • AVOIDS any tilt occurring on the test sensor principal axis and eliminating the component force interference.

DGFT (Digital Force Technology)

  • Close loop digital force sensor cartridge with HIGH RESOLUTION (24bit) with 40k/s sampling rate

 

  • COMPREHENSIVE SOFTWARE
  • SOFTWARE BUILD in with SPC SUPPORT
  • MULTIPLE DATA UOTPUT FORMAT WORD/EXCEL REPORTS
  • DATA PROCESSING and FAILURE STATISTICS REPORT
  • Unique Patented Technology
  • High Reliability
  • Windows Based OS
  • Proven Design
  • Low Cost of Ownership
  • High Precision and Dynamic Sensors
  • Modulated control system with nano-second response rate

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