Laser Semiconductor Failure Analysis System

The FA Cube™ was specifically designed with the semiconductor failure analysis and forensics Labs in mind. Our compact laser semiconductor decapsulation system provides clean and accurate laser IC Decapsulation with reliable results. The FA Cube™ incorporates the same patented process as our FALIT™ series. This patented laser process uses multiple laser configurations to provide clear and precise test samples for nearly every type of semiconductor failure analysis and forensic application.

• Ideal Solution for IC Decapsulation and removing large filler mold compounds for copper.
• Cleanly remove mold compound using laser technology rather than the traditional unsafe acid process.
• Expose Wire Bonds without damage to other components.
• Fixed Co-Axial Optical Camera Lens (options available).
• Optional X-Y stage table and Self-Centering Fixture.
• Easy sliding door with large viewing window and internal workspace.
• Compact Motorized Z-Axis for accuracy (optional).
• FALIT™ Light Laser Software interface included. Basic GUI for Failure Analysis.

Software

Our essential FA Cube intuitive software allows the decapsulation of IC components for bond and die inspection. Aside from the standard software features, we offer a variety of modules and tools to extend the abilities of the machine per request.

Optional Software Tools:

• Gasket Module
• Polygon tools/Ortho Mode
• Surround Mode
• Text Mode
• Image Import
• Template Creation
• Recipe ManagerA